DEVELOPMENT OF HEAT PIPES FOR COOLING THERMALLY STRESSED ELECTRONICS ELEMENTS

An algorithm for the development of heat pipes involving the choice of the working fl uid, materials for the casing and wick, and the methods of calculating the limits of heat-transmitting ability of heat pipes is suggested. This algorithm has been applied successfully for creating different types of wicks and heat pipes on the basis of which a cooling system has been created for a high-power light-emitting diode lantern.
   
Author:  K. I. Delendik, N. V. Kolyago, O. G. Penyazkov, and O. L. Voitik
Keywords:  heat pipe, wick, thermal resistance, light-emitting diode, cooling system, radiator
Page:  1529